印制电路板用三防涂层材料的研究进展

王军军[1];王贤明[1];吴连锋[1];宁亮[1];王波[1]

现代涂料与涂装 ›› 2021, Vol. 24 ›› Issue (7) : 17-20.

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PDF(3858 KB)
现代涂料与涂装 ›› 2021, Vol. 24 ›› Issue (7) : 17-20.

印制电路板用三防涂层材料的研究进展

  • 王军军[1];王贤明[1];吴连锋[1];宁亮[1];王波[1]
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Research Progress of Conformal Coating Material for Printed-circuit Board

  • WANG Jun-jun[1];WANG Xian-ming[1];WU Lian-feng[1];NING Liang[1];WANG Bo[1]
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摘要

现代电子设备在实际服役过程中,常常需要面临高温、高湿、高盐雾等特殊腐蚀环境的侵蚀并表现出高度可靠性,因此必须使用具有防湿热、防盐雾、防霉菌的三防涂层材料对其元器件进行表面防护。印制电路板是现代电子设备的关键部件,其表面的三防保护尤为重要简述了常见的五大类三防涂层材料各自的性能特点,重点综述了国内外研究进展,对涂层的去除工艺进行了简单介绍,指出现有研究中尚未解决的关键问题,并对其下一步研究方向进行了展望。

Abstract

In the practical service situation,modern electronic equipment often needs to resist the erosion of high temperature,high humidity,salt spray and other special corrosion environment and exhibits high reliability.Thus,it is necessary to use conformal coating materials with anti-humidity,anti-salt spray and anti-mold performance for the surface protection of modern electronic equipment.Printed-circuit board(PCB)is a critical component of electronic equipment,therefore its surface conformal protection is particularly important.In this article,the performance characteristics of five common conformal coatings were briefly summarized,the research progresses of conformal coatings were mainly reviewed,and the removal processes of the conformal coatings were briefly introduced.Besides,the limits of current researches and the future development directions of conformal coatings were also pointed out in this paper.

关键词

印制电路板;三防涂料;涂层;去除

Key words

printed-circuit board;conformal coating;coatings;removal process

引用本文

导出引用
王军军[1];王贤明[1];吴连锋[1];宁亮[1];王波[1]. 印制电路板用三防涂层材料的研究进展[J]. 现代涂料与涂装. 2021, 24(7): 17-20
WANG Jun-jun[1];WANG Xian-ming[1];WU Lian-feng[1];NING Liang[1];WANG Bo[1]. Research Progress of Conformal Coating Material for Printed-circuit Board[J]. Modern Paint & Finishing. 2021, 24(7): 17-20
中图分类号: TQ637   

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